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- SST12LF01-QDE
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SST12LF01-QDE Tech Specifications
| Category | RF Front End (LNA PA) | |
| Manufacturer | Microchip | |
| Factory Lead Time | 4 Weeks | |
| Surface Mount | YES | |
| Package / Case | 24-WFQFN Exposed Pad | |
| Number of Pins | 24Pins | |
| Published | 2000 | |
| Packaging | Tape & Reel (TR) | |
| JESD-609 Code | e3 | |
| Pbfree Code | yes | |
| Part Status | Obsolete | |
| Moisture Sensitivity Level (MSL) | 3 (168 Hours) | |
| Number of Terminations | 24Terminations | |
| ECCN Code | EAR99 | |
| Terminal Finish | MATTE TIN | |
| Max Operating Temperature | 80°C | |
| Min Operating Temperature | 0°C |
| HTS Code | 8542.33.00.01 | |
| Terminal Position | QUAD | |
| Peak Reflow Temperature (Cel) | 260 | |
| Number of Functions | 1Function | |
| Supply Voltage | 3.3V | |
| Terminal Pitch | 0.5mm | |
| Frequency | 2.4GHz | |
| Time@Peak Reflow Temperature-Max (s) | 40 | |
| Pin Count | 24 | |
| Temperature Grade | COMMERCIAL EXTENDED | |
| Telecom IC Type | TELECOM CIRCUIT | |
| RF Type | Bluetooth, WLAN | |
| Height Seated (Max) | 0.8mm | |
| Width | 4mm | |
| Length | 4mm | |
| RoHS Status | ROHS3 Compliant | |
| Radiation Hardening | No |
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SST12LF01-QDE Documents
Download datasheets and manufacturer documentation for SST12LF01-QDE
- PCN Obsolescence/ EOLSST1 21/Jul/2016
- PCN PackagingMBB/Label Chgs 16/Nov/2018
- ConflictMineralStatementMicrochip-company-68.pdf
- DatasheetsSST12LF01
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