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SST39LF801C-55-4C-B3KE Tech Specifications

Category Memory
Manufacturer Microchip
Factory Lead Time 7 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 48-TFBGA
Number of Pins 48Pins
Memory Types Non-Volatile
Operating Temperature 0°C~70°C TA
Packaging Tray
Series SST39 MPF™
Published 2010
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 48Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature BOTTOM BOOT BLOCK
HTS Code 8542.32.00.51
Voltage - Supply 3V~3.6V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number SST39LF801
Pin Count 48
Operating Supply Voltage 3.3V
Supply Voltage-Max (Vsup) 3.6V
Supply Voltage-Min (Vsup) 3V
Memory Size 8Mb 512K x 16
Nominal Supply Current 18mA
Access Time 55ns
Memory Format FLASH
Memory Interface Parallel
Data Bus Width 16b
Organization 512KX16
Memory Width 16
Write Cycle Time - Word, Page 10μs
Address Bus Width 19b
Density 8 Mb
Standby Current-Max 0.00002A
Sync/Async Asynchronous
Word Size 16b
Programming Voltage 2.7V
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 256Sectors/Sizes
Sector Size 2K
Ready/Busy YES
Boot Block BOTTOM
Common Flash Interface YES
Length 8mm
Height Seated (Max) 1.2mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
Lead Free Lead Free
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