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UTC2000T-I/MG Tech Specifications
| Category | PMIC - Power Management - Specialized | |
| Manufacturer | Microchip | |
| Factory Lead Time | 8 Weeks | |
| Contact Plating | Tin | |
| Mount | Surface Mount | |
| Mounting Type | Surface Mount | |
| Package / Case | 16-VFQFN Exposed Pad | |
| Number of Pins | 16Pins | |
| Usage Level | Industrial grade | |
| Operating Temperature | -40°C~85°C | |
| Packaging | Tape & Reel (TR) | |
| Published | 2016 | |
| JESD-609 Code | e3 | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Number of Terminations | 16Terminations | |
| Applications | USB, Type-C Controller | |
| HTS Code | 8542.31.00.01 | |
| Voltage - Supply | 4.5V~5.5V | |
| Terminal Position | QUAD | |
| Terminal Form | NO LEAD | |
| Supply Voltage | 5V | |
| Terminal Pitch | 0.5mm | |
| Base Part Number | UTC2000 | |
| Operating Supply Current | 185μA | |
| uPs/uCs/Peripheral ICs Type | BUS CONTROLLER, UNIVERSAL SERIAL BUS | |
| Length | 3mm | |
| Height Seated (Max) | 0.9mm | |
| Width | 3mm | |
| RoHS Status | ROHS3 Compliant |
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UTC2000T-I/MG Documents
Download datasheets and manufacturer documentation for UTC2000T-I/MG
- PCN Design/SpecificationCuPdAu bond wire 14/Dec/2016 BondWire Qual 27/Dec/2016
- PCN PackagingPacking Changes 10/Oct/2016
- PCN Assembly/OriginBond Wire 24/Jan/2018
- ConflictMineralStatementMicrochip-company-68.pdf
- DatasheetsUTC2000 Datasheet
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