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- VSC8582XKS-14
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VSC8582XKS-14 Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | Microchip | |
| Factory Lead Time | 7 Weeks | |
| Mounting Type | Surface Mount | |
| Package / Case | 256-BGA | |
| Surface Mount | YES | |
| Operating Temperature | -40°C~125°C | |
| Packaging | Tray | |
| Part Status | Active | |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) | |
| Number of Terminations | 256Terminations |
| Voltage - Supply | 1V | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Supply Voltage | 1V | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | S-PBGA-B256 | |
| Function | Ethernet | |
| Interface | GMII, SerDes, SPI, TBI | |
| Number of Circuits | 1Circuit | |
| RoHS Status | ROHS3 Compliant |
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VSC8582XKS-14 Documents
Download datasheets and manufacturer documentation for VSC8582XKS-14
- DatasheetsVSC8582-11 Datasheet
- PCN PackagingLabel and Packing 01/Oct/2018 MBB/Label Chgs 16/Nov/2018
- PCN Design/SpecificationMarking Changes 27/Sep/2018 VCSYYY 25/Jun/2019
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