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- ZL88801LDF1
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ZL88801LDF1 Tech Specifications
Category | Interface - Telecom | |
Manufacturer | Microchip | |
Lifecycle Status | IN PRODUCTION (Last Updated: 3 weeks ago) | |
Factory Lead Time | 8 Weeks | |
Mount | Surface Mount | |
Mounting Type | Surface Mount | |
Package / Case | 64-VFQFN Exposed Pad | |
Operating Temperature | -40°C~85°C | |
Packaging | Tape & Reel (TR) | |
Part Status | Active | |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) | |
Number of Terminations | 64Terminations | |
Voltage - Supply | 3.135V~3.465V | |
Terminal Position | QUAD |
Supply Voltage | 3.3V | |
JESD-30 Code | S-XQCC-N64 | |
Function | Telecom Circuit | |
Operating Supply Voltage | 3.3V | |
Interface | PCM | |
Number of Circuits | 1Circuit | |
Operating Supply Current | 25mA | |
Max Supply Voltage (DC) | 3.465V | |
Min Supply Voltage (DC) | 3.135V | |
Length | 9mm | |
Width | 9mm | |
Radiation Hardening | No | |
RoHS Status | ROHS3 Compliant |
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ZL88801LDF1 Documents
Download datasheets and manufacturer documentation for ZL88801LDF1
- PCN Design/SpecificationMarking Change 05/Apr/2019
- PCN PackagingPacking Changes 07/Jul/2019
- PCN OtherMult Devices 06/May/2019
- PCN Part NumberPart Number Change 05/Apr/2019
- PCN Assembly/OriginFab Site 17/Dec/2019
- DatasheetsZL88801
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