NAND04GW3B2BN6F Tech Specifications

Category USB, DVI, HDMI Connectors
Manufacturer Micron Technology
Surface Mount YES
Number of Terminals 48Terminals
Manufacturer Part Number NAND04GW3B2BN6F
Rohs Code Yes
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code TSOP
Package Description TSSOP, TSSOP48,.8,20
Risk Rank 5.63
Access Time-Max 30 ns
Number of Words 536870912 wordsWord
Number of Words Code 512000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TSSOP
Package Equivalence Code TSSOP48,.8,20
Package Shape RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Supply Voltage-Nom (Vsup) 3 V
Reflow Temperature-Max (s) 30
JESD-609 Code e3
Pbfree Code Yes
ECCN Code 3A991.B.1.A
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code compliant
Pin Count 48
JESD-30 Code R-PDSO-G48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Power Supplies 3/3.3 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.03 mA
Organization 512MX8
Seated Height-Max 1.2 mm
Memory Width 8
Standby Current-Max 0.00005 A
Memory Density 4294967296 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 4K
Sector Size 128K
Page Size 2K words
Ready/Busy YES
Length 18.4 mm
Width 12 mm
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