NAND08GW3B2CN6F Tech Specifications

Category USB, DVI, HDMI Connectors
Manufacturer Micron Technology
Surface Mount YES
Number of Terminals 48Terminals
Reflow Temperature-Max (s) 30
Supply Voltage-Nom (Vsup) 3 V
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Package Shape RECTANGULAR
Package Equivalence Code TSSOP48,.8,20
Package Code TSSOP
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Number of Words Code 1000000Words Codes
Number of Words 1048576 wordsWord
Access Time-Max 20 ns
Risk Rank 5.7
Package Description TSSOP, TSSOP48,.8,20
Part Package Code TSOP
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Life Cycle Code Obsolete
Rohs Code Yes
Manufacturer Part Number NAND08GW3B2CN6F
JESD-609 Code e3
Pbfree Code Yes
ECCN Code EAR99
Type SLC NAND TYPE
Terminal Finish Matte Tin (Sn)
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form GULL WING
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Pin Count 48
JESD-30 Code R-PDSO-G48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Power Supplies 3/3.3 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.03 mA
Organization 1MX8
Seated Height-Max 1.2 mm
Memory Width 8
Standby Current-Max 0.00005 A
Memory Density 8388608 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 8K
Sector Size 128K
Page Size 2K words
Ready/Busy YES
Width 12 mm
Length 18.4 mm
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