MT18LSDT1672AG-10EG8 Tech Specifications

Category Memory - Modules
Manufacturer Micron Technology
EU RoHS Not Compliant
ECCN (US) EAR99
Automotive No
PPAP No
Module DRAM Module
Module Density 128Mbyte
Number of Chip per Module 18Chip per Modules
Chip Density (bit) 64M
Data Bus Width (bit) 72
Max. Access Time (ns) 6
Maximum Clock Rate (MHz) 100
Chip Configuration 8Mx8
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 1098
Minimum Operating Temperature (°C) 0
Maximum Operating Temperature (°C) 65
Supplier Temperature Grade Commercial
Module Sides Double
ECC Support Yes
Number of Ranks DualRank
Number of Chip Banks 4Chip Banks
CAS Latency 2
PC Type PC-100
SPD EEPROM Support Yes
Mounting Socket
Package Height 35.08(Max)
Package Width 3.99(Max)
Package Length 133.5(Max)
PCB changed 168
Supplier Package UDIMM
Lead Shape No Lead
Packaging Tray
Part Status Obsolete
Pin Count 168
Organization 16Mx72
PLL No
Refresh Cycles 4K
Self Refresh Yes
Module Type 168UDIMM
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