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MT38W2021A502ZQXZI.X69 Tech Specifications

Category Memory
Manufacturer Micron Technology
Surface Mount YES
Number of Terminals 88Terminals
Package Description TFBGA,
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH
Number of Words Code 4000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Manufacturer Part Number MT38W2021A502ZQXZI.X69
Number of Words 4194304 wordsWord
Package Code TFBGA
Package Shape RECTANGULAR
Manufacturer Micron Technology Inc
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Risk Rank 5.8
Additional Feature IT ALSO CONTAINS 32MBIT(2MBIT X 16) PSRAM
HTS Code 8542.32.00.71
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 0.8 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B88
Supply Voltage-Max (Vsup) 1.95 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 1.7 V
Operating Mode SYNCHRONOUS
Organization 4MX16
Seated Height-Max 1.2 mm
Memory Width 16
Memory Density 67108864 bit
Memory IC Type MEMORY CIRCUIT
Width 8 mm
Length 10 mm
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