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N25Q064A13E14D0F Tech Specifications

Category Memory
Manufacturer Micron Technology
Surface Mount YES
Number of Terminals 24Terminals
Package Description BGA, BGA24,4X6,40
Package Style GRID ARRAY
Number of Words Code 8000000Words Codes
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA24,4X6,40
Operating Temperature-Min -40 °C
Operating Temperature-Max 85 °C
Rohs Code Yes
Manufacturer Part Number N25Q064A13E14D0F
Clock Frequency-Max (fCLK) 108 MHz
Number of Words 8388608 wordsWord
Package Code BGA
Package Shape RECTANGULAR
Manufacturer Micron Technology Inc
Part Life Cycle Code Active
Ihs Manufacturer MICRON TECHNOLOGY INC
Risk Rank 5.79
Type NOR TYPE
Subcategory Flash Memories
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code R-PBGA-B24
Qualification Status Not Qualified
Power Supplies 3/3.3 V
Temperature Grade INDUSTRIAL
Supply Current-Max 0.02 mA
Organization 8MX8
Memory Width 8
Standby Current-Max 0.0001 A
Memory Density 67108864 bit
Parallel/Serial SERIAL
Memory IC Type FLASH
Serial Bus Type SPI
Endurance 100000 Write/Erase Cycles
Data Retention Time-Min 20
Write Protection HARDWARE/SOFTWARE
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