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EDB4432BBPA-1D-F-D Tech Specifications

Category Memory
Manufacturer Micron Technology
Factory Lead Time 12 Weeks
Contact Plating Copper, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 168-WFBGA
Number of Pins 168Pins
Memory Types Volatile
Operating Temperature -30°C~85°C TC
Packaging Bulk
Published 2008
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 168Terminations
ECCN Code EAR99
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Additional Feature AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOMINAL SUPPLY
HTS Code 8542.32.00.36
Voltage - Supply 1.14V~1.95V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.2V
Terminal Pitch 0.5mm
Time@Peak Reflow Temperature-Max (s) 30
Supply Voltage-Max (Vsup) 1.3V
Supply Voltage-Min (Vsup) 1.14V
Memory Size 4Gb 128M x 32
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Memory Format DRAM
Memory Interface Parallel
Data Bus Width 32b
Organization 128MX32
Memory Width 32
Address Bus Width 14b
Density 4 Gb
Max Frequency 533MHz
Access Mode SINGLE BANK PAGE BURST
Length 12mm
Height Seated (Max) 0.8mm
RoHS Status ROHS3 Compliant
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