M29W320ET70ZS6 Tech Specifications

Category Memory - Modules
Manufacturer Micron Technology
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Package Description 11 X 13 MM, 1 MM PITCH, FBGA-64
Access Time-Max 70 ns
Number of Words 2097152 wordsWord
Number of Words Code 2000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Equivalence Code BGA64,8X8,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE
Supply Voltage-Nom (Vsup) 3 V
ECCN Code EAR99
Type NOR TYPE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code unknown
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.7 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.02 mA
Organization 2MX16
Seated Height-Max 1.4 mm
Memory Width 16
Standby Current-Max 0.0001 A
Memory Density 33554432 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 3 V
Alternate Memory Width 8
Data Polling YES
Toggle Bit YES
Command User Interface YES
Number of Sectors/Size 8,63
Sector Size 8K,64K
Ready/Busy YES
Boot Block TOP
Common Flash Interface YES
Length 13 mm
Width 11 mm
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