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MT28F800B3WG-9 TET Tech Specifications

Category Memory
Manufacturer Micron Technology
Mounting Type Surface Mount
Package / Case 48-TFSOP (0.724, 18.40mm Width)
Surface Mount YES
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2002
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Number of Terminations 48Terminations
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature 100,000 ERASE CYCLES; TOP BOOT BLOCK
HTS Code 8542.32.00.51
Voltage - Supply 3V~3.6V
Terminal Position DUAL
Peak Reflow Temperature (Cel) 235
Number of Functions 1Function
Supply Voltage 3.3V
Terminal Pitch 0.5mm
Reach Compliance Code not_compliant
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number MT28F800B3
Pin Count 48
JESD-30 Code R-PDSO-G48
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6V
Power Supplies 3.3V
Supply Voltage-Min (Vsup) 3V
Memory Size 8Mb 1M x 8 512K x 16
Operating Mode ASYNCHRONOUS
Memory Format FLASH
Memory Interface Parallel
Organization 512KX16
Memory Width 16
Write Cycle Time - Word, Page 90ns
Standby Current-Max 0.000005A
Memory Density 8388608 bit
Access Time (Max) 90 ns
Programming Voltage 3V
Endurance 100000 Write/Erase Cycles
Alternate Memory Width 8
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 1217Sectors/Sizes
Sector Size 16K8K96K128K
Boot Block TOP
Length 18.4mm
Height Seated (Max) 1.2mm
Width 12mm
RoHS Status Non-RoHS Compliant
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MT28F800B3WG-9 TET Documents

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