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NAND02GR3B2DZA6E Tech Specifications

Category Memory
Manufacturer Micron Technology
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 63-TFBGA
Number of Pins 63Pins
Memory Types Non-Volatile
Operating Temperature -40°C~85°C TA
Packaging Tray
Published 2008
JESD-609 Code e1
Part Status Discontinued
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 63Terminations
ECCN Code 3A991.B.1.A
Terminal Finish TIN SILVER COPPER
HTS Code 8542.32.00.51
Voltage - Supply 1.7V~1.95V
Terminal Position BOTTOM
Peak Reflow Temperature (Cel) 260
Number of Functions 1Function
Supply Voltage 1.8V
Terminal Pitch 0.8mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number NAND02G
Pin Count 63
Operating Supply Voltage 1.8V
Supply Voltage-Max (Vsup) 1.95V
Supply Voltage-Min (Vsup) 1.7V
Memory Size 2Gb 256M x 8
Nominal Supply Current 20mA
Memory Format FLASH
Memory Interface Parallel
Organization 256MX8
Memory Width 8
Write Cycle Time - Word, Page 45ns
Address Bus Width 8b
Density 2 Gb
Standby Current-Max 0.00005A
Access Time (Max) 25000 ns
Sync/Async Asynchronous
Word Size 8b
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 2K
Sector Size 128K
Page Size 2kB
Ready/Busy YES
Length 11mm
Height Seated (Max) 1.05mm
Radiation Hardening No
RoHS Status ROHS3 Compliant
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