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RC28F256P33TF Tech Specifications

Category Memory - Modules
Manufacturer Micron Technology
Surface Mount YES
Number of Terminals 64Terminals
Rohs Code No
Part Life Cycle Code Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC
Part Package Code BGA
Package Description BGA-64
Access Time-Max 95 ns
Number of Words 16777216 wordsWord
Number of Words Code 16000000Words Codes
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code TBGA
Package Equivalence Code BGA64,8X8,40
Package Shape RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE
Supply Voltage-Nom (Vsup) 3 V
JESD-609 Code e0
Pbfree Code No
ECCN Code EAR99
Type NOR TYPE
Terminal Finish TIN LEAD SILVER
Additional Feature TOP BOOT BLOCK, SYNCHRONOUS BURST MODE OPERATION ALSO AVAILABLE
HTS Code 8542.32.00.51
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code not_compliant
Pin Count 64
JESD-30 Code R-PBGA-B64
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 2.3 V
Operating Mode SYNCHRONOUS
Supply Current-Max 0.031 mA
Organization 16MX16
Seated Height-Max 1.2 mm
Memory Width 16
Standby Current-Max 0.00021 A
Memory Density 268435456 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH
Programming Voltage 2.7 V
Data Polling NO
Toggle Bit NO
Command User Interface YES
Number of Sectors/Size 4,255
Sector Size 16K,64K
Boot Block TOP
Common Flash Interface YES
Length 13 mm
Width 10 mm
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RC28F256P33TF Documents

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