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 - W332M64V-100SBI
 
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 W332M64V-100SBI Tech Specifications
| Category | Memory Cards | |
| Manufacturer | Microsemi | |
| Surface Mount | YES | |
| Number of Terminals | 208Terminals | |
| ECCN (US) | 4A994.a | |
| Module | DRAM Module | |
| Module Density | 256Mbyte | |
| Number of Chip per Module | 4Chip per Modules | |
| Chip Density (bit) | 512M | |
| Data Bus Width (bit) | 64 | |
| Max. Access Time (ns) | 7 | |
| Maximum Clock Rate (MHz) | 100 | |
| Chip Package Type | PBGA | |
| Minimum Operating Supply Voltage (V) | 3 | |
| Typical Operating Supply Voltage (V) | 3.3 | |
| Maximum Operating Supply Voltage (V) | 3.6 | |
| Operating Current (mA) | 460 | |
| Minimum Operating Temperature (°C) | -40 | |
| Maximum Operating Temperature (°C) | 85 | |
| Supplier Temperature Grade | Industrial | |
| ECC Support | No | |
| Number of Chip Banks | 4Chip Banks | |
| CAS Latency | 3|2 | |
| SPD EEPROM Support | No | |
| Supplier Package | BGA | |
| Mounting | Surface Mount | |
| Package Height | 2.27(Max) | |
| Package Length | 22.15(Max) | |
| Package Width | 13.15(Max) | |
| PCB changed | 208 | |
| Package Description | BGA, | |
| Package Style | GRID ARRAY | |
| Number of Words Code | 32000000Words Codes | |
| Package Body Material | PLASTIC/EPOXY | |
| Operating Temperature-Min | -40 °C | |
| Reflow Temperature-Max (s) | 30 | |
| Access Time-Max | 7 ns | |
| Operating Temperature-Max | 85 °C | |
| Rohs Code | No | |
| Manufacturer Part Number | W332M64V-100SBI | 
| Number of Words | 33554432 wordsWord | |
| Supply Voltage-Nom (Vsup) | 3.3 V | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Manufacturer | Microsemi Corporation | |
| Part Life Cycle Code | Transferred | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Risk Rank | 5.37 | |
| Part Package Code | BGA | |
| Pbfree Code | No | |
| Part Status | Unconfirmed | |
| ECCN Code | EAR99 | |
| Additional Feature | AUTO/SELF REFRESH; LG-MAX; WD-MAX; SEATED HT-CALCULATED | |
| HTS Code | 8542.32.00.36 | |
| Technology | CMOS | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | unknown | |
| Pin Count | 208 | |
| JESD-30 Code | R-PBGA-B208 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 3.6 V | |
| Temperature Grade | INDUSTRIAL | |
| Supply Voltage-Min (Vsup) | 3 V | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 32Mx64 | |
| Seated Height-Max | 2.77 mm | |
| Memory Width | 64 | |
| Memory Density | 2147483648 bit | |
| PLL | No | |
| Memory IC Type | SYNCHRONOUS DRAM | |
| Refresh Cycles | 8K | |
| Access Mode | MULTI BANK PAGE BURST | |
| Self Refresh | Yes | |
| Width | 13.15 mm | |
| Length | 22.15 mm | 
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W332M64V-100SBI Documents
Download datasheets and manufacturer documentation for W332M64V-100SBI
- datasheetsmicrosemi-w332m64v100sbi-datasheets-4349.pdf
 
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