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W332M72V-133SBI Tech Specifications

Category Memory Cards
Manufacturer Microsemi
Surface Mount YES
Number of Terminals 208Terminals
ECCN (US) 4A994.a
Module DRAM Module
Module Density 256Mbyte
Number of Chip per Module 5Chip per Modules
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 133
Chip Package Type PBGA
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 575
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
ECC Support Yes
Number of Chip Banks 4Chip Banks
CAS Latency 3|2
SPD EEPROM Support No
Supplier Package BGA
Mounting Surface Mount
Package Height 3.2(Max)
Package Length 22.15(Max)
Package Width 16.15(Max)
PCB changed 208
Package Description BGA,
Package Style GRID ARRAY
Number of Words Code 32000000Words Codes
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Reflow Temperature-Max (s) 30
Access Time-Max 5.5 ns
Operating Temperature-Max 85 °C
Rohs Code No
Manufacturer Part Number W332M72V-133SBI
Number of Words 33554432 wordsWord
Supply Voltage-Nom (Vsup) 3.3 V
Package Code BGA
Package Shape RECTANGULAR
Manufacturer Microsemi Corporation
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Risk Rank 5.37
Part Status Unconfirmed
ECCN Code EAR99
Additional Feature AUTO/SELF REFRESH
HTS Code 8542.32.00.36
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code unknown
Pin Count 208
JESD-30 Code R-PBGA-B208
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 3.6 V
Temperature Grade INDUSTRIAL
Supply Voltage-Min (Vsup) 3 V
Number of Ports 1Port
Operating Mode SYNCHRONOUS
Organization 32Mx72
Memory Width 72
Memory Density 2415919104 bit
PLL No
Memory IC Type SYNCHRONOUS DRAM
Refresh Cycles 8K
Access Mode FOUR BANK PAGE BURST
Self Refresh Yes
RoHS Status Supplier Unconfirmed
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