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Microsemi W3E64M72S-266SBM Memory Connectors Accessories
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W3E64M72S-266SBM Tech Specifications
| Category | Memory Connectors - Accessories | |
| Manufacturer | Microsemi | |
| Surface Mount | YES | |
| Number of Terminals | 219Terminals | |
| Manufacturer Part Number | W3E64M72S-266SBM | |
| Part Life Cycle Code | Contact Manufacturer | |
| Ihs Manufacturer | MERCURY SYSTEMS INC | |
| Package Description | BGA, | |
| Risk Rank | 5.26 | |
| Access Time-Max | 0.75 ns | |
| Number of Words | 67108864 wordsWord | |
| Number of Words Code | 64000000Words Codes | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -55 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | BGA | |
| Package Shape | RECTANGULAR | |
| Package Style | GRID ARRAY | |
| Supply Voltage-Nom (Vsup) | 2.5 V | |
| Reflow Temperature-Max (s) | 30 | |
| ECCN Code | EAR99 |
| Additional Feature | AUTO/SELF REFRESH | |
| HTS Code | 8542.32.00.36 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Peak Reflow Temperature (Cel) | 225 | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1.27 mm | |
| Reach Compliance Code | unknown | |
| JESD-30 Code | R-PBGA-B219 | |
| Qualification Status | Not Qualified | |
| Supply Voltage-Max (Vsup) | 2.7 V | |
| Temperature Grade | MILITARY | |
| Supply Voltage-Min (Vsup) | 2.3 V | |
| Number of Ports | 1Port | |
| Operating Mode | SYNCHRONOUS | |
| Organization | 64MX72 | |
| Memory Width | 72 | |
| Memory Density | 4831838208 bit | |
| Memory IC Type | DDR DRAM | |
| Access Mode | FOUR BANK PAGE BURST | |
| Self Refresh | YES |
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