W3J512M72G-800PBI Tech Specifications

Category Memory Cards
Manufacturer Microsemi
ECCN (US) 4A994.a
Module DRAM Module
Module Density 4Gbyte
Number of Chip per Module 9Chip per Modules
Chip Density (bit) 4G
Data Bus Width (bit) 72
Maximum Clock Rate (MHz) 800
Chip Configuration 512Mx8
Chip Package Type FBGA
Minimum Operating Supply Voltage (V) 1.425
Typical Operating Supply Voltage (V) 1.5
Maximum Operating Supply Voltage (V) 1.575
Operating Current (mA) 1260
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
ECC Support No
Number of Ranks SingleRank
CAS Latency 6
SPD EEPROM Support No
Supplier Package BGA
Mounting Surface Mount
Package Height 5.5(Max)
Package Length 32.25(Max)
Package Width 23.25(Max)
PCB changed 543
Part Status Obsolete
Pin Count 543
Organization 512Mx72
PLL No
Self Refresh Yes
Module Type SODIMM
RoHS Status Supplier Unconfirmed
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