WEDPN16M64V-100B2I Tech Specifications

Category Memory Cards
Manufacturer Microsemi
ECCN (US) 4A994.a
Module DRAM Module
Module Density 1Gbit
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 256M
Data Bus Width (bit) 64
Max. Access Time (ns) 7|7|7|7|7|7|7|7|7|7|7|7|7|7
Maximum Clock Rate (MHz) 100
Chip Configuration 16Mx16
Chip Package Type PBGA
Minimum Operating Supply Voltage (V) 3
Typical Operating Supply Voltage (V) 3.3
Maximum Operating Supply Voltage (V) 3.6
Operating Current (mA) 540
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Supplier Temperature Grade Industrial
Module Sides Single
ECC Support No
Number of Chip Banks 4Chip Banks
CAS Latency 3|2
SPD EEPROM Support No
Supplier Package PBGA
Mounting Surface Mount
Package Height 2.03(Max)
Package Length 21.1(Max)
Package Width 21.1(Max)
PCB changed 219
Part Status Unconfirmed
Pin Count 219
Organization 16Mx64
PLL No
Refresh Cycles 8K
Self Refresh Yes
RoHS Status Supplier Unconfirmed
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