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WF128K32N-70H1M5 Tech Specifications

Category Memory Cards
Manufacturer Microsemi
ECCN (US) 4A994.a
Module Flash Module
Module Density 4Mbit
Number of Chip per Module 4Chip per Modules
Chip Density (bit) 1M
Data Bus Width (bit) 32
Max. Access Time (ns) 70
Chip Configuration 128Kx8
Chip Package Type HIP
PCB changed 66
Package Width 27.3
Package Length 27.3
Package Height 3.71(Max)
Mounting Through Hole
Supplier Package HIP
ECC Support No
Supplier Temperature Grade Military
Maximum Operating Temperature (°C) 125
Minimum Operating Temperature (°C) -55
Operating Current (mA) 140
Maximum Operating Supply Voltage (V) 5.5
Typical Operating Supply Voltage (V) 5
Minimum Operating Supply Voltage (V) 4.5
Part Status Obsolete
Pin Count 66
Organization 128Kx32
Self Refresh No
RoHS Status Supplier Unconfirmed
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WF128K32N-70H1M5 Documents

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