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APA075PQG208I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microsemi Actel
Mounting Type Free Hanging (In-Line)
Housing Material --
Shell Material, Finish Steel, Cadmium Plated
Lead Free Status / RoHS Status --
Voltage, Rating --
Contact Materials Copper Alloy
Operating Temperature --
Series AMPLIMITE HDM
Packaging --
Part Status Active
Moisture Sensitivity Level (MSL) --
Termination Crimp
Connector Type Receptacle, Female Sockets
Number of Positions 37Positions
Color --
Number of Rows 2Rows
Contact Type Signal
Ingress Protection --
Current Rating --
Contact Finish Gold
Wire Gauge --
Flange Feature Housing/Shell (Unthreaded)
Connector Style D-Sub
Contact Form --
Shell Size, Connector Layout 4 (DC, C)
Backset Spacing --
Features --
Contact Finish Thickness 50.0µin (1.27µm)
Material Flammability Rating --
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