APA150-FFG256 Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microsemi Actel
Surface Mount YES
Number of Terminals 256Terminals
RoHS Non-Compliant
Package Description 1 MM PITCH, FBGA-256
Package Style GRID ARRAY
eak Reflow Temperature-Max (s) 30
Moisture Sensitivity Levels 3
Package Body Material PLASTIC/EPOXY
Package Equivalence Code BGA256,16X16,40
Supply Voltage-Nom 2.5 V
Supply Voltage-Min 2.3 V
Operating Temperature-Max 70 °C
Rohs Code No
Manufacturer Part Number APA150-FFG256
Clock Frequency-Max 180 MHz
Package Code BGA
Package Shape SQUARE
Manufacturer Microsemi Corporation
Part Life Cycle Code Obsolete
Ihs Manufacturer MICROSEMI CORP
Supply Voltage-Max 2.7 V
Risk Rank 5.9
JESD-609 Code e0
Terminal Finish TIN LEAD/TIN LEAD SILVER
HTS Code 8542.39.00.01
Subcategory Field Programmable Gate Arrays
Technology CMOS
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Terminal Pitch 1 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B256
Number of Outputs 186Outputs
Qualification Status Not Qualified
Power Supplies 2.5,2.5/3.3 V
Temperature Grade COMMERCIAL
Number of Inputs 186Inputs
Organization 150000 GATES
Seated Height-Max 1.8 mm
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Cells 6144Logic Cells
Number of Equivalent Gates 150000Equivalent Gates
Width 17 mm
Length 17 mm
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