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APA300PQG208I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microsemi Actel
Mounting Type Through Hole
Housing Material Thermoplastic
Contact Material - Plating --
Clamp Material - Plating Brass - Nickel Plated
Screw Material - Plating Steel - Zinc Plated
Torque-Screw 0.4 Nm (3.5 Lb-In)
Operating Temperature -40°C ~ 115°C
Series YR
Packaging Bulk
Part Status Active
Color Green
Pitch 0.197 (5.00mm)
Wire Gauge 12-24 AWG
Voltage 300V
Number of Levels 1Level
Current 10A
Positions Per Level 18
Mating Orientation Horizontal with Board
Wire Termination Screw - Rising Cage Clamp
Screw Thread M2.5
Features High Wire Entry Level, Interlocking (Side)
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