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5962-9669005HYC Tech Specifications

Category Memory - Modules
Manufacturer Micro Crystal
Surface Mount NO
Number of Terminals 32Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code MODULE
Package Description ,
Access Time-Max 60 ns
Number of Words 131072 wordsWord
Number of Words Code 128000Words Codes
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Shape RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e4
ECCN Code 3A001.A.2.C
Terminal Finish GOLD
Additional Feature 100K ERASE/PROGRAM CYCLES
HTS Code 8542.32.00.51
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Reach Compliance Code unknown
Pin Count 32
JESD-30 Code R-CDMA-T32
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 4.5 V
Operating Mode ASYNCHRONOUS
Organization 128KX8
Memory Width 8
Memory Density 1048576 bit
Parallel/Serial PARALLEL
Memory IC Type FLASH MODULE
Programming Voltage 5 V
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