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A2F060M3E-1FG256I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256Pins
Number of I/Os MCU - 26, FPGA - 66I/O
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2009
JESD-609 Code e0
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F060M3E
Number of Outputs 66Outputs
Operating Supply Voltage 1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Logic Blocks (LABs) 8Logic Blocks (LABs)s
Speed Grade 1
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Number of Registers 1536Registers
Number of Equivalent Gates 60000Equivalent Gates
Flash Size 128KB
Radiation Hardening No
RoHS Status Non-RoHS Compliant
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