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A2F060M3E-1FG256M Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Package / Case 256-LBGA
Number of Pins 256Pins
Number of I/Os MCU - 26, FPGA - 66I/O
Operating Temperature -55°C~125°C TJ
Packaging Tray
Series SmartFusion®
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
HTS Code 8542.39.00.01
Reach Compliance Code unknown
Frequency 100MHz
Base Part Number A2F060M3E
Interface EBI/EMI, I2C, SPI, UART, USART
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS Status Non-RoHS Compliant
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A2F060M3E-1FG256M Documents

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