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A2F060M3E-FG256 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 2 Weeks
Mount Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Supplier Device Package 256-FPBGA (17x17)
Number of I/Os MCU - 26, FPGA - 66I/O
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F060M3E
Operating Supply Voltage 1.5V
Interface EBI/EMI, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Speed 80MHz
RAM Size 16KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Max Frequency 100MHz
Number of Logic Blocks (LABs) 8Logic Blocks (LABs)s
Primary Attributes ProASIC®3 FPGA, 60K Gates, 1536D-Flip-Flops
Flash Size 128KB
RoHS Status Non-RoHS Compliant
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A2F060M3E-FG256 Documents

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