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A2F200M3F-1FG256I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 12 Weeks
Package / Case 256-LBGA
Surface Mount YES
Number of Pins 256Pins
Number of I/Os MCU - 25, FPGA - 66I/O
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2009
JESD-609 Code e0
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 100MHz
Time@Peak Reflow Temperature-Max (s) 20
Base Part Number A2F200
Number of Outputs 66Outputs
Supply Voltage-Max (Vsup) 1.575V
Supply Voltage-Min (Vsup) 1.425V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Operating Supply Current 3mA
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Number of Gates 200000Gates
Number of Logic Blocks (LABs) 8Logic Blocks (LABs)s
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Length 17mm
Height Seated (Max) 1.7mm
Width 17mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
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A2F200M3F-1FG256I Documents

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