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A2F200M3F-CS288 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 12 Weeks
Package / Case 288-TFBGA, CSPBGA
Supplier Device Package 288-CSP (11x11)
Number of I/Os MCU - 31, FPGA - 78I/O
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 85°C
Min Operating Temperature 0°C
Frequency 80MHz
Base Part Number A2F200
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Speed 80MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
RoHS Status Non-RoHS Compliant
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A2F200M3F-CS288 Documents

Download datasheets and manufacturer documentation for   A2F200M3F-CS288

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