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A2F200M3F-FGG484 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 2 Weeks
Package / Case 484-BGA
Surface Mount YES
Number of Pins 484Pins
Number of I/Os MCU - 41, FPGA - 94I/O
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®
Published 2011
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 484Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 250
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 80MHz
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number A2F200
Number of Outputs 94Outputs
Qualification Status Not Qualified
Operating Supply Voltage 1.5V
Power Supplies 1.51.82.53.3V
Interface EBI/EMI, Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Memory Size 4.5kB
Operating Supply Current 7mA
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity EBI/EMI, Ethernet, I2C, SPI, UART/USART
Data Rate 400 kbps
Architecture MCU, FPGA
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 2500Logic Elements/Cells
Core Architecture ARM
Number of Gates 200000Gates
Primary Attributes ProASIC®3 FPGA, 200K Gates, 4608 D-Flip-Flops
Flash Size 256KB
Length 23mm
Height Seated (Max) 2.44mm
Width 23mm
RoHS Status RoHS Compliant
Lead Free Lead Free
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A2F200M3F-FGG484 Documents

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