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A2F500M3G-1PQ208I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Factory Lead Time 10 Weeks
Mount Surface Mount
Package / Case 208-BFQFP
Number of Pins 208Pins
Supplier Device Package 208-PQFP (28x28)
Number of I/Os MCU - 22, FPGA - 66I/O
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®
Published 2015
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 100MHz
Base Part Number A2F500M3G
Operating Supply Voltage 1.5V
Interface Ethernet, I2C, SPI, UART, USART
Max Supply Voltage 1.575V
Min Supply Voltage 1.425V
Speed 100MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DMA, POR, WDT
Connectivity Ethernet, I2C, SPI, UART/USART
Architecture MCU, FPGA
Core Architecture ARM
Max Frequency 100MHz
Number of Logic Blocks (LABs) 24Logic Blocks (LABs)s
Primary Attributes ProASIC®3 FPGA, 500K Gates, 11520 D-Flip-Flops
Flash Size 512KB
RoHS Status Non-RoHS Compliant
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A2F500M3G-1PQ208I Documents

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