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A3P600-FG256I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microsemi
Factory Lead Time 12 Weeks
Contact Plating Lead, Silver, Tin
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Weight 400.011771mg
Number of I/Os 177I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series ProASIC3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
ECCN Code 3A001.A.7.A
Terminal Finish TIN LEAD/TIN LEAD SILVER
HTS Code 8542.39.00.01
Voltage - Supply 1.425V~1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Frequency 231MHz
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number A3P600
Operating Supply Voltage 1.5V
RAM Size 13.5kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 110592
Number of Gates 600000Gates
Number of Registers 13824Registers
Height 1.2mm
Length 17mm
Width 17mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
Lead Free Contains Lead
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