AGL600V2-FGG256I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microsemi
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 17 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Weight 400.011771mg
Number of I/Os 177I/Os
Operating Temperature -40°C~85°C TA
Packaging Tray
Series IGLOO
Published 2009
JESD-609 Code e1
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
HTS Code 8542.39.00.01
Voltage - Supply 1.14V~1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 260
Supply Voltage 1.2V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 40
Base Part Number AGL600
Operating Supply Voltage 1.5V
RAM Size 13.5kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 13824Logic Elements/Cells
Total RAM Bits 110592
Number of Gates 600000Gates
Max Frequency 892.86MHz
Height 1.2mm
Length 17mm
Width 17mm
Radiation Hardening No
RoHS Status RoHS Compliant
Lead Free Lead Free
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