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APTLGL325A1208G Tech Specifications

Category Power Driver Modules
Manufacturer Microsemi
Lifecycle Status IN PRODUCTION (Last Updated: 3 weeks ago)
Factory Lead Time 36 Weeks
Mount Screw
Mounting Type Through Hole
Package / Case 6-PowerSIP Module
Number of Pins 9Pins
Number of Elements 1 Element
Operating Temperature (Max.) 150°C
Published 2001
Part Status Active
Moisture Sensitivity Level (MSL) 1 (Unlimited)
Type IGBT
Voltage - Isolation 2500Vrms
Configuration Half Bridge
Voltage 1.2kV
Current 420A
Power Dissipation-Max (Abs) 1500W
VCEsat-Max 2.2 V
Radiation Hardening No
RoHS Status RoHS Compliant
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APTLGL325A1208G Documents

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