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M1AFS250-2FG256I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microsemi
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 12 Weeks
Mount Surface Mount
Mounting Type Surface Mount
Package / Case 256-LBGA
Number of Pins 256Pins
Weight 400.011771mg
Number of I/Os 114I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series Fusion®
Published 2013
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 256Terminations
Terminal Finish TIN LEAD/TIN LEAD SILVER
Voltage - Supply 1.425V~1.575V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.5V
Terminal Pitch 1mm
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number M1AFS250
Operating Supply Voltage 1.5V
RAM Size 4.5kB
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Total RAM Bits 36864
Number of Gates 250000Gates
Max Frequency 1.47059GHz
Speed Grade 2
Number of Registers 6144Registers
Height 1.2mm
Length 17mm
Width 17mm
Radiation Hardening No
RoHS Status Non-RoHS Compliant
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M1AFS250-2FG256I Documents

Download datasheets and manufacturer documentation for   M1AFS250-2FG256I

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