M2GL090-1FCS325I Tech Specifications

Category Embedded - FPGAs (Field Programmable Gate Array)
Manufacturer Microsemi
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 10 Weeks
Mounting Type Surface Mount
Package / Case 325-TFBGA
Surface Mount YES
Number of I/Os 180I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series IGLOO2
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 325Terminations
HTS Code 8542.39.00.01
Voltage - Supply 1.14V~2.625V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 240
Supply Voltage 1.2V
Time@Peak Reflow Temperature-Max (s) 20
JESD-30 Code S-PBGA-B325
Number of Outputs 180Outputs
Qualification Status Not Qualified
Power Supplies 1.2V
Number of Inputs 180Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Number of Logic Elements/Cells 86184Logic Elements/Cells
Total RAM Bits 2648064
Number of Logic Cells 86316Logic Cells
RoHS Status Non-RoHS Compliant
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