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M2S010-1FG484I Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 8 Weeks
Package / Case 484-BGA
Number of Pins 484Pins
Supplier Device Package 484-FPBGA (23x23)
Number of I/Os 233I/Os
Operating Temperature -40°C~100°C TJ
Packaging Tray
Series SmartFusion®2
Published 2009
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Max Operating Temperature 100°C
Min Operating Temperature -40°C
Frequency 166MHz
Base Part Number M2S010
Operating Supply Voltage 1.2V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
Max Supply Voltage 1.26V
Min Supply Voltage 1.14V
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Core Architecture ARM
Primary Attributes FPGA - 10K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant
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