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M2S050TS-1FG896 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Lifecycle Status IN PRODUCTION (Last Updated: 2 weeks ago)
Factory Lead Time 10 Weeks
Package / Case 896-BGA
Supplier Device Package 896-FBGA (31x31)
Number of I/Os 377I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2015
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Speed 166MHz
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Primary Attributes FPGA - 50K Logic Modules
Flash Size 256KB
RoHS Status Non-RoHS Compliant
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