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M2S150-FCG1152 Tech Specifications

Category Embedded - System On Chip (SoC)
Manufacturer Microsemi
Lifecycle Status IN PRODUCTION (Last Updated: 1 month ago)
Factory Lead Time 12 Weeks
Package / Case 1152-BBGA, FCBGA
Surface Mount YES
Number of I/Os 574I/Os
Operating Temperature 0°C~85°C TJ
Packaging Tray
Series SmartFusion®2
Published 2009
JESD-609 Code e3
Part Status Active
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Terminal Finish MATTE TIN
HTS Code 8542.39.00.01
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Supply Voltage 1.2V
Terminal Pitch 1mm
Frequency 166MHz
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Base Part Number M2S150
JESD-30 Code S-PBGA-B1152
Number of Outputs 574Outputs
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 1.26V
Power Supplies 1.2V
Supply Voltage-Min (Vsup) 1.14V
Interface CAN, Ethernet, I2C, SPI, UART, USART, USB
RAM Size 64KB
Core Processor ARM® Cortex®-M3
Peripherals DDR, PCIe, SERDES
Connectivity CANbus, Ethernet, I2C, SPI, UART/USART, USB
Architecture MCU, FPGA
Number of Inputs 574Inputs
Programmable Logic Type FIELD PROGRAMMABLE GATE ARRAY
Core Architecture ARM
Primary Attributes FPGA - 150K Logic Modules
Number of Logic Cells 146124Logic Cells
Flash Size 512KB
Length 35mm
Height Seated (Max) 2.9mm
Width 35mm
RoHS Status RoHS Compliant
Lead Free Lead Free
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