Microsemi Corporation PM8373-NGI Telecom Interface ICs
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PM8373-NGI Tech Specifications
| Category | Interface - Telecom | |
| Manufacturer | Micro Crystal | |
| Surface Mount | YES | |
| Number of Terminals | 196Terminals | |
| Rohs Code | Yes | |
| Part Life Cycle Code | Obsolete | |
| Ihs Manufacturer | MICROSEMI CORP | |
| Package Description | LBGA, | |
| Moisture Sensitivity Levels | 3 | |
| Operating Temperature-Max | 125 °C | |
| Operating Temperature-Min | -40 °C | |
| Package Body Material | PLASTIC/EPOXY | |
| Package Code | LBGA | |
| Package Shape | SQUARE | |
| Package Style | GRID ARRAY, LOW PROFILE |
| Supply Voltage-Nom | 1.8 V | |
| HTS Code | 8542.39.00.01 | |
| Terminal Position | BOTTOM | |
| Terminal Form | BALL | |
| Number of Functions | 1Function | |
| Terminal Pitch | 1 mm | |
| Reach Compliance Code | compliant | |
| JESD-30 Code | S-PBGA-B196 | |
| Qualification Status | Not Qualified | |
| Temperature Grade | AUTOMOTIVE | |
| Seated Height-Max | 1.5 mm | |
| Telecom IC Type | INTERFACE CIRCUIT | |
| Length | 15 mm | |
| Width | 15 mm |
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PM8373-NGI Documents
Download datasheets and manufacturer documentation for PM8373-NGI
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