WS512K32-20G2UM Tech Specifications

Category Memory
Manufacturer Micro Crystal
Surface Mount YES
Number of Terminals 68Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MICROSEMI CORP
Part Package Code QFP
Package Description 22.40 X 22.40 MM, 3.56 MM HEIGHT, HERMETIC SEALED, CERAMIC, QFP-68
Access Time-Max 20 ns
Number of Words 524288 wordsWord
Number of Words Code 512000Words Codes
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code QFP
Package Shape SQUARE
Package Style FLATPACK
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e4
Pbfree Code No
ECCN Code 3A001.A.2.C
Terminal Finish GOLD
Additional Feature USER CONFIGURABLE AS 2M X 8
HTS Code 8542.32.00.41
Terminal Position QUAD
Terminal Form GULL WING
Number of Functions 1Function
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 68
JESD-30 Code S-CQFP-G68
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 4.5 V
Operating Mode ASYNCHRONOUS
Organization 512KX32
Seated Height-Max 3.51 mm
Memory Width 32
Memory Density 16777216 bit
Screening Level MIL-STD-883
Parallel/Serial PARALLEL
Memory IC Type SRAM MODULE
Alternate Memory Width 16
Length 22.36 mm
Width 22.36 mm
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