ZL30107GGG Tech Specifications

Category Clock/Timing - Application Specific
Manufacturer Microsemi ZARLINK
Package / Case Axial
Surface Mount YES
Supplier Device Package Axial
Number of Terminals 64Terminals
Package Description BGA,
Package Style GRID ARRAY
Package Body Material PLASTIC/EPOXY
Operating Temperature-Min -40 °C
Supply Voltage-Nom 1.8 V
Operating Temperature-Max 85 °C
Manufacturer Part Number ZL30107GGG
Package Code BGA
Package Shape SQUARE
Manufacturer Microchip Technology Inc
Part Life Cycle Code Active
Ihs Manufacturer MICROCHIP TECHNOLOGY INC
Risk Rank 5.65
Operating Temperature -55°C ~ 155°C
Series RNF
Packaging Tape & Reel (TR)
Size / Dimension 0.093 Dia x 0.250 L (2.35mm x 6.35mm)
Tolerance ±1%
Part Status Active
Number of Terminations 2Terminations
Temperature Coefficient ±100ppm/°C
Resistance 1.24 kOhms
Composition Metal Film
Power (Watts) 0.25W, 1/4W
Terminal Position BOTTOM
Terminal Form BALL
Number of Functions 1Function
Terminal Pitch 1 mm
Reach Compliance Code compliant
JESD-30 Code S-PBGA-B64
Failure Rate --
Temperature Grade INDUSTRIAL
Seated Height-Max 1.72 mm
Telecom IC Type TELECOM CIRCUIT
Features Flame Retardant Coating, Safety
Height Seated (Max) --
Width 9 mm
Length 9 mm
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