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ZL30107GGG Tech Specifications
Category | Clock/Timing - Application Specific | |
Manufacturer | Microsemi ZARLINK | |
Package / Case | Axial | |
Surface Mount | YES | |
Supplier Device Package | Axial | |
Number of Terminals | 64Terminals | |
Package Description | BGA, | |
Package Style | GRID ARRAY | |
Package Body Material | PLASTIC/EPOXY | |
Operating Temperature-Min | -40 °C | |
Supply Voltage-Nom | 1.8 V | |
Operating Temperature-Max | 85 °C | |
Manufacturer Part Number | ZL30107GGG | |
Package Code | BGA | |
Package Shape | SQUARE | |
Manufacturer | Microchip Technology Inc | |
Part Life Cycle Code | Active | |
Ihs Manufacturer | MICROCHIP TECHNOLOGY INC | |
Risk Rank | 5.65 | |
Operating Temperature | -55°C ~ 155°C | |
Series | RNF | |
Packaging | Tape & Reel (TR) |
Size / Dimension | 0.093 Dia x 0.250 L (2.35mm x 6.35mm) | |
Tolerance | ±1% | |
Part Status | Active | |
Number of Terminations | 2Terminations | |
Temperature Coefficient | ±100ppm/°C | |
Resistance | 1.24 kOhms | |
Composition | Metal Film | |
Power (Watts) | 0.25W, 1/4W | |
Terminal Position | BOTTOM | |
Terminal Form | BALL | |
Number of Functions | 1Function | |
Terminal Pitch | 1 mm | |
Reach Compliance Code | compliant | |
JESD-30 Code | S-PBGA-B64 | |
Failure Rate | -- | |
Temperature Grade | INDUSTRIAL | |
Seated Height-Max | 1.72 mm | |
Telecom IC Type | TELECOM CIRCUIT | |
Features | Flame Retardant Coating, Safety | |
Height Seated (Max) | -- | |
Width | 9 mm | |
Length | 9 mm |
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