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AS8F512K32P-150 Tech Specifications

Category Memory - Modules
Manufacturer Micross
Surface Mount NO
Number of Terminals 66Terminals
Rohs Code No
Part Life Cycle Code Active
Ihs Manufacturer MICROSS COMPONENTS
Package Description PGA, PGA66,11X11
Access Time-Max 150 ns
Number of Words 524288 wordsWord
Number of Words Code 512000Words Codes
Operating Temperature-Max 125 °C
Operating Temperature-Min -55 °C
Package Body Material CERAMIC, METAL-SEALED COFIRED
Package Code PGA
Package Equivalence Code PGA66,11X11
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Nom (Vsup) 5 V
ECCN Code 3A001.A.2.C
Type NOR TYPE
Additional Feature ALSO HAVING 8-BIT WIDTH
HTS Code 8542.32.00.51
Terminal Position PERPENDICULAR
Terminal Form PIN/PEG
Peak Reflow Temperature (Cel) NOT SPECIFIED
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code compliant
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
JESD-30 Code S-CPGA-P66
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade MILITARY
Supply Voltage-Min (Vsup) 4.5 V
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.24 mA
Organization 512KX32
Memory Width 32
Standby Current-Max 0.0065 A
Memory Density 16777216 bit
Screening Level MIL-STD-883
Parallel/Serial PARALLEL
Memory IC Type FLASH MODULE
Programming Voltage 5 V
Alternate Memory Width 16
Data Polling YES
Toggle Bit YES
Number of Sectors/Size 32Sectors/Sizes
Sector Size 16K
Length 29.718 mm
Width 29.718 mm
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AS8F512K32P-150 Documents

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