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MCM511001AP80 Tech Specifications

Category Memory
Manufacturer
Surface Mount NO
Number of Terminals 18Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code DIP
Package Description DIP, DIP18,.3
Access Time-Max 80 ns
Number of Words 1048576 wordsWord
Number of Words Code 1000000Words Codes
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code DIP
Package Equivalence Code DIP18,.3
Package Shape RECTANGULAR
Package Style IN-LINE
Supply Voltage-Nom (Vsup) 5 V
JESD-609 Code e0
ECCN Code EAR99
Terminal Finish Tin/Lead (Sn/Pb)
Additional Feature RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
HTS Code 8542.32.00.02
Terminal Position DUAL
Terminal Form THROUGH-HOLE
Number of Functions 1Function
Terminal Pitch 2.54 mm
Reach Compliance Code unknown
Pin Count 18
JESD-30 Code R-PDIP-T18
Qualification Status Not Qualified
Supply Voltage-Max (Vsup) 5.5 V
Temperature Grade COMMERCIAL
Supply Voltage-Min (Vsup) 4.5 V
Number of Ports 1Port
Operating Mode ASYNCHRONOUS
Supply Current-Max 0.07 mA
Organization 1MX1
Output Characteristics 3-STATE
Seated Height-Max 4.57 mm
Memory Width 1
Standby Current-Max 0.001 A
Memory Density 1048576 bit
I/O Type SEPARATE
Memory IC Type NIBBLE MODE DRAM
Refresh Cycles 512
Access Mode NIBBLE
Length 22.1 mm
Width 7.62 mm
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