MPC8260ZUIFBB3 Tech Specifications

Category Embedded - Microprocessors
Manufacturer
Surface Mount YES
Number of Terminals 480Terminals
Part Life Cycle Code Obsolete
Ihs Manufacturer MOTOROLA INC
Part Package Code BGA
Package Description LBGA,
Clock Frequency-Max 66 MHz
Operating Temperature-Max 70 °C
Package Body Material PLASTIC/EPOXY
Package Code LBGA
Package Shape SQUARE
Package Style GRID ARRAY, LOW PROFILE
Supply Voltage-Max 2.7 V
Supply Voltage-Min 2.4 V
ECCN Code 3A991.A.2
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
Pin Count 480
JESD-30 Code S-PBGA-B480
Qualification Status Not Qualified
Temperature Grade COMMERCIAL
Speed 200 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 1.65 mm
Address Bus Width 32
Boundary Scan YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Length 37.5 mm
Width 37.5 mm
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MPC8260ZUIFBB3 Documents

Download datasheets and manufacturer documentation for   MPC8260ZUIFBB3

  • Datasheets
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