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SPAK56F827FG80 Tech Specifications

Category Embedded - DSP (Digital Signal Processors)
Manufacturer
Surface Mount YES
Number of Terminals 128Terminals
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Part Package Code QFP
Package Description LFQFP,
Clock Frequency-Max 80 MHz
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Package Body Material PLASTIC/EPOXY
Package Code LFQFP
Package Shape RECTANGULAR
Package Style FLATPACK, LOW PROFILE, FINE PITCH
Supply Voltage-Max 2.75 V
Supply Voltage-Min 2.25 V
Supply Voltage-Nom 2.5 V
ECCN Code 3A991.A.2
Additional Feature ALSO REQUIRES 3.3V SUPPLY
HTS Code 8542.31.00.01
Terminal Position QUAD
Terminal Form GULL WING
Terminal Pitch 0.5 mm
Reach Compliance Code unknown
Pin Count 128
JESD-30 Code R-PQFP-G128
Qualification Status Not Qualified
Temperature Grade INDUSTRIAL
uPs/uCs/Peripheral ICs Type DIGITAL SIGNAL PROCESSOR, CONTROLLER
Seated Height-Max 1.6 mm
Address Bus Width 16
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 16
Format FIXED POINT
Barrel Shifter YES
Internal Bus Architecture MULTIPLE
Length 20 mm
Width 14 mm
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SPAK56F827FG80 Documents

Download datasheets and manufacturer documentation for   SPAK56F827FG80

  • Datasheets
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