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MMBV3700LT1 Tech Specifications

Category Diodes - RF
Manufacturer
Surface Mount YES
Material synthetic polyolefin
Diode Element Material SILICON
Number of Terminals 3Terminals
Exterior Housing Material 1
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Package Description R-PDSO-G3
Operating Temperature-Max 125 °C
Package Body Material PLASTIC/EPOXY
Package Shape RECTANGULAR
Package Style SMALL OUTLINE
Diameter of protected wire (cable) 55…95 mm
Diameter before shrinkage 100 mm
Diameter after shrinkage 50.0 mm
Wall thickness before shrinkage 0.7 mm
Wall thickness after shrinkage 1.46 mm
Gross weight 181.88
Transport packaging size/quantity 102*20*20/80
Packaging in 1m cut lengths
JESD-609 Code e0
ECCN Code EAR99
Type Non-adhesive heat shrink tube
Terminal Finish Tin/Lead (Sn/Pb)
Color blue
HTS Code 8541.10.00.80
Terminal Position DUAL
Terminal Form GULL WING
Reach Compliance Code unknown
JESD-30 Code R-PDSO-G3
Qualification Status Not Qualified
Configuration SINGLE
Diode Type PIN DIODE
Operating temperature range -55…+125 °C
JEDEC-95 Code TO-236AB
Shrink temperature +70…+120 °C
Breakdown Voltage-Min 200 V
Reverse Test Voltage 20 V
2nd Connector Number of Positions Loaded SWITCHING
Frequency Band VERY HIGH FREQUENCY
Diode Capacitance-Nom 1 pF
Diode Capacitance-Max 1 pF
Diode Res Test Current 10 mA
Diode Forward Resistance-Max 1 Ω
Operating voltage 600 V
Shrink Ratio 2 : 1
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MMBV3700LT1 Documents

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MMBV3700LT1 brand manufacturers: Motorola Semiconductor Products, Elecinsight stock, MMBV3700LT1 reference price.Motorola Semiconductor Products. MMBV3700LT1 parameters, MMBV3700LT1 Datasheet PDF and pin diagram description download.You can use the MMBV3700LT1 Diodes - RF, DSP Datesheet PDF, find MMBV3700LT1 pin diagram and circuit diagram and usage method of function,MMBV3700LT1 electronics tutorials.You can download from the Elecinsight.