Elecinsight electronic parts stores,electronic components,electronic parts,electronics parts supply
My List
Order Status & History RFQ History WISH LIST
$ 0.00

XPC755BPX350LD Tech Specifications

Category Embedded - Microprocessors
Manufacturer
Surface Mount YES
Number of Terminals 360Terminals
Rohs Code No
Part Life Cycle Code Transferred
Ihs Manufacturer MOTOROLA INC
Package Description 25 X 25 MM, 2.77 MM HEIGHT, 1.27 MM PITCH, PLASTIC, FCBGA-360
Clock Frequency-Max 100 MHz
Package Body Material PLASTIC/EPOXY
Package Code BGA
Package Shape SQUARE
Package Style GRID ARRAY
Supply Voltage-Max 2.1 V
Supply Voltage-Min 1.9 V
Supply Voltage-Nom 2 V
JESD-609 Code e0
ECCN Code 3A991.A.2
Terminal Finish Tin/Lead (Sn/Pb)
HTS Code 8542.31.00.01
Terminal Position BOTTOM
Terminal Form BALL
Terminal Pitch 1.27 mm
Reach Compliance Code unknown
JESD-30 Code S-PBGA-B360
Qualification Status Not Qualified
Speed 350 MHz
uPs/uCs/Peripheral ICs Type MICROPROCESSOR, RISC
Bit Size 32
Seated Height-Max 2.77 mm
Address Bus Width 32
Boundary Scan YES
Low Power Mode YES
External Data Bus Width 64
Format FLOATING POINT
Integrated Cache YES
Length 25 mm
Width 25 mm
Select at least one checkbox above to show similar products in this category.
View Similar

XPC755BPX350LD Documents

Download datasheets and manufacturer documentation for   XPC755BPX350LD

  • Datasheets
XPC755BPX350LD brand manufacturers: Motorola Semiconductor Products, Elecinsight stock, XPC755BPX350LD reference price.Motorola Semiconductor Products. XPC755BPX350LD parameters, XPC755BPX350LD Datasheet PDF and pin diagram description download.You can use the XPC755BPX350LD Embedded - Microprocessors, DSP Datesheet PDF, find XPC755BPX350LD pin diagram and circuit diagram and usage method of function,XPC755BPX350LD electronics tutorials.You can download from the Elecinsight.