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- 2227MC-14-03-10-F1
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2227MC-14-03-10-F1 Tech Specifications
| Category | Barrel - Audio Connectors | |
| Manufacturer | Multicomp | |
| Contact Plating | Gold Plated Contacts | |
| Housing Material | POLYBUTYLENE TEREPHTHALATE | |
| Pitch Spacing | 2.54mm | |
| Contact Materials | Beryllium Copper | |
| Rohs Code | Yes | |
| Manufacturer Part Number | 2227MC-14-03-10-F1 | |
| Manufacturer | SPC Multicomp | |
| Part Life Cycle Code | Contact Manufacturer | |
| Samacsys Description | MULTICOMP - 2227MC-14-03-10-F1 - SUPPORT DE CI DIP 14 VOIES 0.3 | |
| Ihs Manufacturer | SPC TECHNOLOGY/ MULTICOMP |
| Risk Rank | 4.77 | |
| JESD-609 Code | e4 | |
| ECCN Code | EAR99 | |
| Connector Type | DIP Socket | |
| Additional Feature | STANDARD: UL94-0 | |
| HTS Code | 8536.69.40.40 | |
| Reach Compliance Code | unknown | |
| Number of Contacts | 14Contacts | |
| Contact Finish Termination | Gold (Au) | |
| Device Socket Type | IC SOCKET | |
| Device Type Used On | DIP14 |
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